Hirose DF59 Series Male Crimp Terminal, 22 AWG Min Crimp, 22 AWG Max
- N° de stock RS:
- 738-8782
- Référence fabricant:
- DF59-22PCFA
- Fabricant:
- Hirose
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 738-8782
- Référence fabricant:
- DF59-22PCFA
- Fabricant:
- Hirose
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Hirose | |
| Product Type | Crimp Terminal | |
| Gender | Male | |
| For Use With | DF59 Connector Housing | |
| Current | 3A | |
| Series | DF59 | |
| Contact Plating | Gold | |
| Minimum Wire Size AWG | 22AWG | |
| Maximum Wire Size mm² | 0.3mm² | |
| Contact Material | Copper Alloy | |
| Maximum Wire Size AWG | 22AWG | |
| Maximum Contact Resistance | 30mΩ | |
| Termination Type | Crimp | |
| Minimum Operating Temperature | -35°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Hirose | ||
Product Type Crimp Terminal | ||
Gender Male | ||
For Use With DF59 Connector Housing | ||
Current 3A | ||
Series DF59 | ||
Contact Plating Gold | ||
Minimum Wire Size AWG 22AWG | ||
Maximum Wire Size mm² 0.3mm² | ||
Contact Material Copper Alloy | ||
Maximum Wire Size AWG 22AWG | ||
Maximum Contact Resistance 30mΩ | ||
Termination Type Crimp | ||
Minimum Operating Temperature -35°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
- Pays d'origine :
- JP
Hirose DF59 Crimp Contacts
Crimp contact for the Hirose DF59 series.
Hirose DF59 Series
The Hirose DF59 series features a low profile design that minimises shadowing and a positive swing-lock engagement, which provides strong plug retention against cable pull. Additionally, the Hirose DF59 series offers a floating board-to-board connector which allows ± 0.5mm floating function in XYZ directions, reducing contact stress. With the Hirose DF59 series, multiple board-to-board connections are possible, minimizing the issue of thermal expansion and reducing component quantity. Applications include LED lighting, power supplies, battery connection and small DC motor drives.
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