onsemi KSB1366GTU Transistor, 3 A PNP, 60 V, 3-Pin TO-220F
- N° de stock RS:
- 806-2744
- Référence fabricant:
- KSB1366GTU
- Fabricant:
- onsemi
Actuellement indisponible
Désolés, nous ne savons pas quand ce produit sera réapprovisionné.
- N° de stock RS:
- 806-2744
- Référence fabricant:
- KSB1366GTU
- Fabricant:
- onsemi
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | onsemi | |
| Product Type | Transistor | |
| Maximum DC Collector Current Idc | 3A | |
| Maximum Collector Emitter Voltage Vceo | 60V | |
| Package Type | TO-220F | |
| Mount Type | Through Hole | |
| Transistor Configuration | Single | |
| Maximum Collector Base Voltage VCBO | -60V | |
| Maximum Transition Frequency ft | 9MHz | |
| Transistor Polarity | PNP | |
| Maximum Emitter Base Voltage VEBO | -7V | |
| Minimum DC Current Gain hFE | 20 | |
| Maximum Power Dissipation Pd | 25W | |
| Pin Count | 3 | |
| Maximum Operating Temperature | 150°C | |
| Width | 4.9mm | |
| Standards/Approvals | No | |
| Height | 29.45mm | |
| Length | 10.36mm | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque onsemi | ||
Product Type Transistor | ||
Maximum DC Collector Current Idc 3A | ||
Maximum Collector Emitter Voltage Vceo 60V | ||
Package Type TO-220F | ||
Mount Type Through Hole | ||
Transistor Configuration Single | ||
Maximum Collector Base Voltage VCBO -60V | ||
Maximum Transition Frequency ft 9MHz | ||
Transistor Polarity PNP | ||
Maximum Emitter Base Voltage VEBO -7V | ||
Minimum DC Current Gain hFE 20 | ||
Maximum Power Dissipation Pd 25W | ||
Pin Count 3 | ||
Maximum Operating Temperature 150°C | ||
Width 4.9mm | ||
Standards/Approvals No | ||
Height 29.45mm | ||
Length 10.36mm | ||
Automotive Standard No | ||
Power PNP Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
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