Nexperia BC846AQCZ Transistor, 100 mA NPN, 65 V, 3-Pin SOT-8009
- N° de stock RS:
- 240-1784
- Référence fabricant:
- BC846AQCZ
- Fabricant:
- Nexperia
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 240-1784
- Référence fabricant:
- BC846AQCZ
- Fabricant:
- Nexperia
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Nexperia | |
| Product Type | Transistor | |
| Maximum DC Collector Current Idc | 100mA | |
| Maximum Collector Emitter Voltage Vceo | 65V | |
| Package Type | SOT-8009 | |
| Mount Type | Surface | |
| Maximum Collector Base Voltage VCBO | 80V | |
| Minimum DC Current Gain hFE | 220 | |
| Maximum Emitter Base Voltage VEBO | 6V | |
| Minimum Operating Temperature | -55°C | |
| Transistor Polarity | NPN | |
| Maximum Power Dissipation Pd | 450mW | |
| Pin Count | 3 | |
| Maximum Operating Temperature | 150°C | |
| Length | 1.2mm | |
| Height | 1.4mm | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Nexperia | ||
Product Type Transistor | ||
Maximum DC Collector Current Idc 100mA | ||
Maximum Collector Emitter Voltage Vceo 65V | ||
Package Type SOT-8009 | ||
Mount Type Surface | ||
Maximum Collector Base Voltage VCBO 80V | ||
Minimum DC Current Gain hFE 220 | ||
Maximum Emitter Base Voltage VEBO 6V | ||
Minimum Operating Temperature -55°C | ||
Transistor Polarity NPN | ||
Maximum Power Dissipation Pd 450mW | ||
Pin Count 3 | ||
Maximum Operating Temperature 150°C | ||
Length 1.2mm | ||
Height 1.4mm | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Nexperia NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
High power dissipation capability
High voltage (max. 65 V)
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
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