TE Connectivity, 1410965-2 1.8 mm Pitch High Speed Backplane Connector, Vertical, 16 Column, 9 Row, 144 Way
- N° de stock RS:
- 788-023
- Référence fabricant:
- 1410965-2
- Fabricant:
- TE Connectivity
Sous-total (1 tube de 17 unités)*
483,30 €
(TVA exclue)
584,79 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Nouveau produit - précommandez dès aujourd'hui
- Expédition à partir du 05 octobre 2026
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Tube(s) | le tube | Prix par unité* |
|---|---|---|
| 1 + | 483,30 € | 28,429 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 788-023
- Référence fabricant:
- 1410965-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | High Speed Backplane Connector | |
| Number of Contacts | 144 | |
| Current | 1A | |
| Orientation | Vertical | |
| Number of Columns | 16 | |
| Number of Rows | 9 | |
| Housing Material | Thermoplastic | |
| Pitch | 1.8mm | |
| Mount Type | PCB | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Series | 1410965-2 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type High Speed Backplane Connector | ||
Number of Contacts 144 | ||
Current 1A | ||
Orientation Vertical | ||
Number of Columns 16 | ||
Number of Rows 9 | ||
Housing Material Thermoplastic | ||
Pitch 1.8mm | ||
Mount Type PCB | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
Series 1410965-2 | ||
- Pays d'origine :
- US
The TE Connectivity vertical receptacle connector designed for use in demanding embedded computing applications. It provides reliable and High performance connectivity in rugged environments, ensuring integrity under challenging conditions.
Built for VITA architecture, enhancing compatibility with established systems
Utilises compliant pin technology for improved alignment and reduced mating force
Designed to accommodate high-speed data transfer rates, supporting enhanced system performance
Offers exceptional durability with a minimum of 500 mating cycles, ensuring long-term reliability
Liens connexes
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