Molex, 76155 1.9 mm Pitch 4 Pair Backplane Connector, Vertical, 10 Column, 12 Row, 120 Way

Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
N° de stock RS:
691-354
Référence fabricant:
76155-1127
Fabricant:
Molex
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Marque

Molex

Backplane Connector Type

4 Pair

Product Type

Backplane Connector

Current

0.75A

Number of Contacts

120

Number of Columns

10

Orientation

Vertical

Voltage

30V

Number of Rows

12

Housing Material

High Temperature Thermoplastic

Pitch

1.9mm

Contact Material

High Performance Alloy

Mount Type

Through Hole

Contact Plating

Gold over Tin

Termination Type

Pin

Minimum Operating Temperature

-55°C

Contact Gender

Male

Maximum Operating Temperature

85°C

Standards/Approvals

EU RoHS

Series

76155

Pays d'origine :
SG
The Molex Impact 100 Ohm 4 Pair Vertical Backplane Header serves as a Crucial component for high-speed data transmission in modern electronics. With its 120 circuits and vertical orientation, this connector is designed for seamless integration into space-constrained backplane applications. It boasts a duel endwall configuration and a robust construction, ensuring reliable performance under various environmental conditions. The lead-free design adheres to contemporary compliance standards, making it suitable for diverse industries. Its optimal pin length of 4.90mm and plated through-hole dimension provide exceptional connectivity, allowing for efficient data transfer rates of up to 25 Gbps. This product embodies the quality and performance required for today’s Advanced electronic systems.

Vertical orientation optimises space and simplifies PCB layouts

Designed for durability with a maximum of 200 mating cycles, ensuring longevity

High-performance alloy material enhances electrical conductivity

Gold mating and tin termination plating ensure reliable connections

Designed for through-hole termination, offering stable mounting on PCBs

Incorporates standard dimensions for easy mating with compatible connectors

No PCB retention features Streamline assembly processes

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