Molex, 171348 1.9 mm Pitch Connector Backplane Connector, Vertical, 8 Column, 12 Row, 96 Way
- N° de stock RS:
- 684-916
- Référence fabricant:
- 171348-1828
- Fabricant:
- Molex
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 684-916
- Référence fabricant:
- 171348-1828
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Backplane Connector Type | Connector | |
| Product Type | Backplane Connector | |
| Number of Contacts | 96 | |
| Current | 750mA | |
| Number of Columns | 8 | |
| Orientation | Vertical | |
| Number of Rows | 12 | |
| Voltage | 30V | |
| Pitch | 1.9mm | |
| Contact Plating | Gold over Tin | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS | |
| Series | 171348 | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Backplane Connector Type Connector | ||
Product Type Backplane Connector | ||
Number of Contacts 96 | ||
Current 750mA | ||
Number of Columns 8 | ||
Orientation Vertical | ||
Number of Rows 12 | ||
Voltage 30V | ||
Pitch 1.9mm | ||
Contact Plating Gold over Tin | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS | ||
Series 171348 | ||
- Pays d'origine :
- SG
The Molex Impact 100 Ohm 4 Pair Vertical Orthogonal Header is engineered for high-performance connectivity in challenging environments. Designed to accommodate 96 circuits and deliver data rates up to 25.0 Gbps, this advanced component features a robust plating of gold and tin, ensuring reliable performance and longevity. With a pin length of 5.50mm and optimised for through-hole termination, this header offers straightforward integration into existing PCB designs. Its vertical orientation and dual endwall construction provide enhanced space efficiency and facilitate seamless assembly, making it the ideal choice for various backplane applications.
Constructed with High Performance Alloy for superior durability
Vertical configuration saves space and enhances design flexibility
Compliant with RoHS and low halogen standards for environmental safety
Constructed to withstand up to 200 mating cycles, ensuring longevity
Black resin colour enhances aesthetic integration with PCBs
Mentions compatibility with orthogonal daughter cards, broadening application potential
Optimised for 1mm PCB thickness, ensuring compatibility with standard designs