Molex, 171745 1.9 mm Pitch Connector Backplane Connector, Vertical, 10 Column, 4 Row, 40 Way
- N° de stock RS:
- 683-570
- Référence fabricant:
- 171745-1107
- Fabricant:
- Molex
Sous-total (1 plateau de 20 unités)*
219,72 €
(TVA exclue)
265,86 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 30 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 219,72 € | 10,986 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 683-570
- Référence fabricant:
- 171745-1107
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Backplane Connector Type | Connector | |
| Product Type | Backplane Connector | |
| Number of Contacts | 40 | |
| Current | 0.75A | |
| Number of Columns | 10 | |
| Orientation | Vertical | |
| Number of Rows | 4 | |
| Voltage | 29.9 V | |
| Pitch | 1.9mm | |
| Contact Plating | Gold over Tin | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS | |
| Series | 171745 | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Backplane Connector Type Connector | ||
Product Type Backplane Connector | ||
Number of Contacts 40 | ||
Current 0.75A | ||
Number of Columns 10 | ||
Orientation Vertical | ||
Number of Rows 4 | ||
Voltage 29.9 V | ||
Pitch 1.9mm | ||
Contact Plating Gold over Tin | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS | ||
Series 171745 | ||
- Pays d'origine :
- SG
The Molex Impel 90 Ohm, 2 Pair Vertical Backplane Header is expertly designed to facilitate robust connectivity in electronic applications. With a sophisticated 1.90mm pitch and a configuration featuring 10 columns and 40 circuits, this component ensures reliable data transfer at speeds of up to 40.0 Gbps. Its vertical orientation and plated through hole design make it ideal for backplane applications, providing a secure connection in space-constrained environments. Crafted from high-performance alloy and high-temperature thermoplastic, the Impel header is built to endure demanding conditions, making it a reliable choice for various technological ecosystems.
Constructed with a durable high performance alloy for long lasting reliability
Compliant with EU RoHS standards, ensuring minimal environmental impact
Low Halogen design contributes to safer end of life disposal
Vertical orientation optimises space management in compact installations
Configured with 40 circuits maximising connection capabilities
Compatible with multiple daughter card configurations to enhance versatility