TE Connectivity, 4-2271 2.54 mm Pitch Eurocard Connector Backplane Connector, Straight Female, 32 Column, 3 Row, 96 Way

Sous-total (1 plateau de 90 unités)*

242,32 €

(TVA exclue)

293,21 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Stocké-e par le fabricant
  • Prêt à être expédié à partir du 25 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +242,32 €2,692 €

*Prix donné à titre indicatif

N° de stock RS:
509-950
Numéro d'article Distrelec:
304-50-756
Référence fabricant:
4-2271014-0
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

Backplane Connector

Backplane Connector Type

Eurocard Connector

Current

1.5A

Number of Contacts

96

Number of Columns

32

Orientation

Straight

Number of Rows

3

Voltage

100V

Connector Gender

Female

Pitch

2.54mm

Mount Type

Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

China RoHS 2 MIIT Order No 32, EU RoHS 2011/65/EU, 2016, EU ELV 2000/53/EC

Series

4-2271

Pays d'origine :
CN
The TE Connectivity Receptacle connector is designed for board-to-board applications, offering unparalleled reliability with its robust construction. Featuring 96 positions and a 2.54 mm centreline, this connector is ideal for various electronic circuit board configurations. The vertical orientation, combined with a three-row design, ensures efficient space utilisation and enhances connectivity in compact environments. Its durable grey body, coupled with high-quality brass contacts, promises excellent mechanical and electrical performance. Operating seamlessly within a voltage range of up to 1000 VDC, this component is built to withstand demanding conditions while maintaining signal integrity. The connector’s superior termination method guarantees secure and long-lasting connections, making it a vital addition to any project requiring dependable board-to-board interconnect solutions.

Engineered for board-to-board configurations, ensuring seamless integration

Vertical orientation optimises space within dense electronic assemblies

Constructed with high-quality brass contacts for enhanced conductivity

Ideal for applications requiring signal integrity and stability

Designed to operate efficiently within a -55 to 105 °C temperature range

Features wave solder capability, accommodating various soldering processes

Compliant with EU RoHS and ELV directives for greater environmental responsibility

Offers a robust packaging solution to ensure component protection during transit

Liens connexes