TE Connectivity, 2329739-1 3.9 mm Pitch Connector Backplane Connector, Right Angle Female, 8 Column, 4 Row, 64 Way

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Sous-total (1 tube de 16 unités)*

552,87 €

(TVA exclue)

668,97 €

(TVA incluse)

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Stocké-e par le fabricant
  • Prêt à être expédié à partir du 25 juin 2026
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Tube(s)
le tube
Prix par unité*
1 +552,87 €34,554 €

*Prix donné à titre indicatif

N° de stock RS:
474-311
Numéro d'article Distrelec:
304-64-007
Référence fabricant:
2329739-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Backplane Connector Type

Connector

Product Type

Backplane Connector

Number of Contacts

64

Current

0.4A

Number of Columns

8

Orientation

Right Angle

Voltage

80V

Connector Gender

Female

Number of Rows

4

Housing Material

Liquid Crystal Polymer

Pitch

3.9mm

Contact Material

Phosphor Bronze

Mount Type

PCB

Contact Plating

Tin

Minimum Operating Temperature

-55°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

No

Series

2329739-1

Pays d'origine :
CN
The TE Connectivity High-speed backplane connector is specifically designed to meet the rigorous demands of modern electronic applications. Featuring a unique four-row, eight-column arrangement, this connector is perfect for printed circuit board (PCB) mounting, ensuring reliable connections that facilitate optimal signal integrity. With advanced STRADA Whisper technology, it accommodates high data rates while maintaining low impedance and durability. The right-angle, unshrouded design enhances versatility in compact spaces, making it an ideal choice for sophisticated electronic systems. Its robust construction, combined with superior mating alignment features, guarantees long-term reliability and performance in various operational environments. The operating temperature range and substantial cycle durability ensure that this component stands resilient against the challenges posed by dynamic applications.

Utilises advanced STRADA Whisper technology for superior data transmission

Designed for both traditional backplane architectures and board to board connections

Offers exceptional PCB mount retention ensuring secure placement

Constructed from high quality LCP material for enhanced thermal performance

Includes a mating alignment mechanism for precise connections

Features tin plated contact areas for improved conductivity and reliability

Supports a robust operating temperature range for diverse applications

Compliant with various industry standards to ensure safety and efficiency

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