Okdo ROCK 3 Compute Module (CM3) 2GB/16GB WIFI/BT
- N° de stock RS:
- 249-3154
- Référence fabricant:
- RM116-D2E16W2
- Fabricant:
- Okdo
68 En stock, livraison sous 1 jour(s) (stock Europe)
381 En stock, livraison sous 3 à 5 jours (stock Europe)
Prix la pièce
43,15 €
(TVA exclue)
52,21 €
(TVA incluse)
Unité | Prix par unité |
|---|---|
| 1 - 49 | 43,15 € |
| 50 - 99 | 42,01 € |
| 100 + | 40,61 € |
- N° de stock RS:
- 249-3154
- Référence fabricant:
- RM116-D2E16W2
- Fabricant:
- Okdo
Documentation technique
Législations et de normes
- Pays d'origine :
- CN
Détails du produit
The ROCK 3 Compute Module (CM3) is a System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC), Quad-core Arm® Cortex®-A55 CPU and Arm Mali™-G52-2EE GPU. This CM3 is designed to increase the performance and capabilities of your design applications. With a 2GB LPDDR4 RAM, 16GB eMMC flash storage and wireless connectivity, including WiFi 5 and Bluetooth® 5.0, and many other class-leading features incorporated in this compact board of just 55mm x 40mm, the ROCK 3 Compute Module can be easily integrated into different industrial and multimedia projects. CM3 is developed by OKdo Technology in collaboration with Radxa, providing an out-of-the-box, cost-efficient solution that expands the capabilities of various embedded applications.
Key features of the ROCK CM3 2GB:
Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz
GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1
CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz
NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.
RAM: 2GB LPDDR4
Memory: 32bit DDR4/3/3L/LPDDR4/4X/3 and support eMMC 5.1 and SFC
Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface
Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder
Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface
Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).
High-Speed Interface: One USB 3.0 host, two SATA 3.0, one PCIE2.1, two SerDes (serialiser/deserialiser) lanes, dual USB 2.0 host and one USB 2.0 OTG and a single RGMII interface
Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)
Power Requirements: the power input into the SoM is 5VDC at 5A.
Interfaces:
802.11 b/g/n/ac Wireless LAN (Wi-Fi 5)
Bluetooth 5.0 with BLE
8 x I2C
4 x SPI
8 x UART
9 x PWM
50 x GPIO
2 x ADC
1 x Gigabit Ethernet PHY
Support PDM with microphone array
I2S
2 x SATA
1 x PCIe 2.0, 1 lane host (5Gbps)
1 x USB 2.0
1 x USB 2.0 OTG
1 x USB 3.0 (5Gbps)
1 x SDIO 3.0
1 x HDMI up to 4K x 2k@60Hz
1 x eDP four lanes (2.7 Gbps per lane)
2 x MIPI DSI @ 1.6Gbps per lane
2 x MIPI CSI
1 x 2 lane MIPI CSI camera port
1 x 4 lane MIPI CSI camera port
1 x LVDS combo four lanes, mux with MIPI DSIO
eMMC size: 16GB
3 x 100 pins 0.4mm pitch B2B connector
Supported Software:
Debian/Ubuntu Linux support
Android 11 support
Spécifications
Attribut | Valeur |
|---|---|
| Product Name | ROCK 3 Compute Module (CM3) 2GB/16GB WIFI/BT |
| RAM Size | 2 GB |
| Model Number | Compute Module 3 |
| Port Connections | CSI, DSI, HDMI, USB2, USB3 |
| Operating System | Android, Debian, Linux |