Heatsink, Clip, 25 x 25 x 28mm, Clip

High-performance precision-forged clip-attachment heatsinks for BGA chipsets.

AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop

BGA Heatsinks