Bergquist Self-Adhesive Thermal Gap Pad, 3.2 mm Thick, 2.4 W/mK, 100 mm, 100 mm, Fibreglass Reinforced Polymer

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Sous-total (1 unité)*

43,27 €

(TVA exclue)

52,36 €

(TVA incluse)

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*Prix donné à titre indicatif

N° de stock RS:
287-6551
Numéro d'article Distrelec:
175-59-937
Référence fabricant:
2165424
Fabricant:
Bergquist
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Marque

Bergquist

Product Type

Thermal Gap Pad

Thickness

3.2mm

Thermal Conductivity

2.4W/mK

Self-Adhesive

Yes

Conductive Material

Fibreglass Reinforced Polymer

Hardness

20 Shore 00

Standards/Approvals

RoHS Compliant

Length

100mm

Width

100 mm

Colour

Light Yellow

Maximum Operating Temperature

200°C

Minimum Operating Temperature

-60°C

Pays d'origine :
CN
The gap pad is a highly conformable and thermally conductive material designed for low-stress applications that require excellent heat transfer. With a thermal conductivity of 2.4 W/m-K, this reinforced 'S-Class' material is ideal for use between processors and heat sinks, graphics chips and heat sinks, and in DVD and CDROM electronics cooling. Its ultra conformable and gel-like modulus makes it easy to handle and provides added tear resistance. The Gap Pad 2500S20 is well-suited for low-pressure applications that use fixed standoff or clip mounting.

Thermal conductivity of 2.4 W/m-K for efficient heat transfer

Reinforced with fiberglass for added tear resistance

Ultra-conformable and gel-like modulus for easy handling

Designed for low-stress applications

Inherent surface tack on both sides for stick-in-place characteristics during assembly

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