SOCKET P HARDWARE DUST COVER

Documentation technique
Législations et de normes
Déclaration de conformité RoHS
Détails du produit

TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling. As one of a limited number of suppliers of this technology, TE is your dependable socket partner to support current and future Intel CPU processor designs.

Two-piece design for increased reliability: First LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability
Dependable partner: As new generations of chip platforms are developed, TE will offer the latest LGA sockets for your designs
APPLICATIONS
Servers
Data Centers
High Performance Computing (HPC)

Spécifications
Attribut Valeur
IC Socket Type Prototyping Socket
Package Type LGA
Housing Material ABS, Polycarbonate
84 En stock pour livraison sous 1 jour(s)
Prix Each
4,80
(TVA exclue)
5,81
(TVA incluse)
Unité
Prix par unité
1 - 4
4,80 €
5 - 9
4,60 €
10 +
4,30 €
Options de conditionnement :