Electrolube Epoxy Thermal Adhesive, 48 h Cure, 1.1W/mK, 20 ml Syringe

  • N° de stock RS 155-8320
  • Référence fabricant TBS20S
  • Fabricant Electrolube
Documentation technique
Législations et de normes
Déclaration de conformité RoHS
Pays d'origine : GB
Détails du produit

Electrolube Thermal Bonding System

The TBS (thermal bonding sytsem) from Electrolube is a two part, thermally conductive epoxy system perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital. The Electrolube thermal bonding system features metal oxides that provide high quality thermal conductivity whilst being electrically insulating. This versatile TBS offers a wide operating range of -40°C to + 120°C, allowing you to work with a variety of applications. The two part epoxy system is quick and easy to mix, with a usable life of 3 to 4 hours once mixed and is ideal for room temperature curing if required.

Features and benefits

• Wide operating range of -40°C to +120°C, ideal for use with a variety of applications
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Room temperature curing, with shorter rates achievable at higher temperatures
• Easy to mix blue (A) and cream (B) coloured parts, with a 3:1 (A:B) mixing ratio
• High thermal conductivity: 1.10 W/m.K

Application

Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin. with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:

• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors

How to apply

Before applying, ensure surfaces are clean and free from grease, dust and contaminants. Begin by mixing the two parts of the compound together as per the mix ratio. Once mixed, apply a thin film, to the base and mounting studs of many component types including diodes, transistors, thyristors, heatsinks, silicone rectifiers, semiconductors, thermostats, power resistors and radiators.

Can this thermal adhesive be removed?

Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times.

What is the maximum operating temperature?

The maximum operating temperature of this thermal compound is +120°C.

Spécifications
Attribut Valeur
Adhesive Type Thermal Adhesive
Package Type Syringe
Package Size 20 ml
Cure Time 48 h
Maximum Operating Temperature +120°C
Minimum Operating Temperature -40°C
Operating Temperature Range -40 → +120 °C
51 En stock, livraison dès le lendemain
Prix Each
22,97
(TVA exclue)
27,79
(TVA incluse)
Unité
Prix par unité
1 +
22,97 €