- N° de stock RS:
- 182-2753
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions
En cours d'approvisionnement - expédition le 03/10/2024, livraison sous 4 jour(s)
Ajouté
Prix la pièce
32,04 €
(TVA exclue)
38,77 €
(TVA incluse)
Unité | Prix par unité |
1 - 9 | 32,04 € |
10 - 24 | 31,14 € |
25 - 49 | 30,31 € |
50 - 99 | 29,50 € |
100 + | 28,74 € |
- N° de stock RS:
- 182-2753
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions
Documentation technique
Législations et de normes
- Pays d'origine :
- US
Détails du produit
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Spécifications
Attribut | Valeur |
---|---|
Package Type | SMD |
IC Socket Type | Prototyping Socket |
- N° de stock RS:
- 182-2753
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions